KIOXIA CM9 Series PCIe 5.0 NVMe SSD Raises the Bar with CBA Chip Architecture.

KIOXIA America, announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs. These next-generation drives are the first enterprise SSDs built with KIOXIA’s 8^th generation BiCS FLASH TLC–based 3D flash memory, which incorporates CBA (CMOS directly Bonded to Array) technology – an architectural innovation that delivers significant advances in power efficiency, performance and density, while doubling available capacity per flash device.

“KIOXIA is enabling more efficient scaling of AI operations while helping to reduce power consumption and total cost of ownership across data center environments.”

As the demands of modern computing intensify, applications such as AI, machine learning, and high-performance computing require a sophisticated solid state storage infrastructure – requiring not only enterprise-class performance but also higher power efficiency to ensure scalability and manageable operational costs. Addressing these requirements is central to the design of the KIOXIA CM9 Series, which is purpose-built to support next-generation data center workloads.

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At the core of the CM9 Series is KIOXIA’s 8^th generation BiCS FLASH, the company’s most advanced 3D flash memory to date. This technology employs a CBA-based architecture that significantly increases the NAND interface speed, enhances density and power efficiency and lowers latency – directly benefitting SSD performance.

KIOXIA CM9 Series drives deliver performance improvements of up to approximately 65% in random write, 55% in random read, and 95% in sequential write compared to the previous generation. In addition, performance-per-watt gains realized include 55% better sequential read and 75% better sequential write efficiency.

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KIOXIA CM9 Series SSD highlights include (preliminary and subject to change):

• PCIe 5.0, NVMe 2.0, NVMe-MI 1.2c, and OCP Datacenter NVMe SSD 2.5 specification-compliant
• Dual-port support in 2.5-inch and E3.S SSD form factors
• Read-intensive (1 DWPD) and mixed-use (3 DWPD) endurances
• Sequential performance (128 kibibytes (KiB)/QD32) – 14.8 GB/s read and 11 GB/s write
• Random performance (4KiB) – 3,400 KIOPS (QD512) and 800 KIOPS (QD32)
• 2.5-inch capacities up to 61.44 terabytes (TB) and E3.S capacities up to 30.72 TB

“We are proud to integrate the latest BiCS FLASH 3D flash memory technology into our enterprise SSDs, bringing enhanced performance and power efficiency to AI-centric workloads,” said Neville Ichhaporia, senior vice president and general manager of the SSD business unit at KIOXIA America, Inc. “As AI models grow in complexity and scale, the need for storage solutions that can sustain high throughput and low latency, and allow for better thermal efficiency, becomes critical. With the addition of the CM9 Series, KIOXIA is enabling more efficient scaling of AI operations while helping to reduce power consumption and total cost of ownership across data center environments.”

KIOXIA CM9 Series SSDs are now sampling to select customers and will be showcased at Dell Technologies World, taking place May 19 – 22 in Las Vegas.