or call: +1 (845) 347-8894

or call: +1 (845) 347-8894
or call: +1 (845) 347-8894
Amphenol, a global leader in high-performance interconnect solutions, and Semtech Corporation a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today introduced a leading-edge 1.6T OSFP Active Copper Cable (ACC) product featuring Semtech’s CopperEdge 224G/lane linear equalizer/redriver ICs, targeted for use in next-generation AI/ML and data center infrastructure.
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The explosion of data center deployments to support new AI/ML applications and workloads is driving requirements for ever higher-bandwidth interconnect solutions between compute and storage resources in clusters. Amphenol’s 1.6T OSFP ACC with Semtech’s CopperEdge technology is designed for use with leading-edge 200G/lane switches and xPUs, and provides the extended reach required to connect adjacent equipment racks with high performance and reliability.
“We expect deployment of 224G/lane data center infrastructure starting in 2025 and ramping rapidly over the coming years, as AI/ML applications continue to push the envelope on performance and interconnect bandwidth,” commented Bob Wheeler, analyst at large, LightCounting. “We see 1.6T active copper cables (ACCs) as a key tool to support these higher interconnect speeds at manageable power consumption and cost.”
Compared to alternative approaches, the 1.6T OSFP ACC provides
“We’re excited to collaborate with Semtech on this 1.6T interconnect innovation,” said Greg Walz, director of product marketing for high-speed I/O Cables at Amphenol. “The 1.6T ACC is a key addition to our industry-leading interconnect portfolio for leading-edge data center customers interested in high-performance, low power solutions.”
“The combination of Amphenol’s world-class cable technology and manufacturing scale with Semtech’s advanced semiconductor capability creates a powerful customer offering,” added Brian Bentham, data center market manager at Semtech. “Together, we are delivering technology that is helping deliver the reliable, high-bandwidth, low-power connectivity enabling next-generation AI/ML infrastructure.”
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Source – prnewswire